TIIF–2026: International Strategic Cooperation in Higher Education and Innovation Reaches a New Level
Within the framework of the Tashkent International Investment Forum, key agreements were signed with South Korea, China, and Governful to develop AI and engineering education.
During the Tashkent International Investment Forum (TIIF—2026), Deputy Minister of Higher Education, Science, and Innovation Oktam Salomov participated in several strategic meetings:
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Uzbekistan–Korea Cooperation: A memorandum was signed with KOICA to implement a grant project worth 870 million Korean won in the field of Artificial Intelligence (AI). The project includes the development of an "AI Professor Platform" and capacity building for educators.
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Digital Solutions with Governful: Discussions with Governful CEO Nathan Benson focused on AI-based LMS platforms, the Science ID system, and intelligent monitoring mechanisms for scientific grants and research integrity.
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UrSU and China’s Industrial Giant: Urgench State University signed a strategic partnership agreement with XCMG Group and Xuzhou University of Technology. This agreement aims to strengthen the integration of education and industry while training highly competitive engineering specialists based on international standards.
